An edition of Solder Joint Reliability Prediction for Multiple Environments (2008)

Solder Joint Reliability Prediction for Multiple Environments

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Cover of: Solder Joint Reliability Prediction for Multiple Environments by Andrew Eugene Perkins
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Last edited by MARC Bot
December 27, 2022 | History
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An edition of Solder Joint Reliability Prediction for Multiple Environments (2008)

Solder Joint Reliability Prediction for Multiple Environments

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Publish Date
Publisher
Springer

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Subjects

Engineering, Materials, System safety, Electronics, Optical materials, Electronic apparatus and appliances, reliability, Solder and soldering, Joints (engineering), Electronic apparatus and appliances, Reliability, Joints (Engineering)
Edition Availability
Cover of: Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
2008, Springer

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Book Details

Classifications

Library of Congress
TA1-2040, TK7870.15 .P47 2009

Edition Identifiers

Open Library
OL26148527M
Internet Archive
solderjointrelia00perk
ISBN 13
9780387793931
OCLC/WorldCat
227018275

Work Identifiers

Work ID
OL17558130W

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Internet Archive item record
Internet Archive item record
Better World Books record
marc_columbia MARC record
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History

Download catalog record: RDF / JSON
December 27, 2022 Edited by MARC Bot import existing book
December 25, 2021 Edited by ImportBot import existing book
July 7, 2019 Edited by MARC Bot import existing book
October 14, 2016 Edited by Mek Added new cover
October 14, 2016 Created by Mek Added new book.