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S. Liu

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Applications of experimental mechanics to electronic packaging--1997--: presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

by J. C. Suhling and S. Liu First published in 1997 — 1 edition

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LED packaging for lighting applications: design, manufacturing, and testing

by S. Liu First published in 2011 — 1 edition

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Modeling and simulation for microelectronic packaging assembly: manufacture, reliability, and testing

by S. Liu First published in 2011 — 1 edition

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Instruments for optics and optoelectronic inspection and control: 8-10 November 2000, Beijing, China

by S. Liu First published in 2000 — 1 edition
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Thermo-mechanical characterization of evolving packaging materials and structures: presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

by S. Liu First published in 1998 — 1 edition

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OLID: OL6945058A

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Created July 26, 2011
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