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Jan Vardaman

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Surface Mount Technology: Recent Japanese Developments

by Jan Vardaman First published in 1992 — 1 edition

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Worldwide developments in MCP integration: markets & trends

by Jan Vardaman First published in 1998 — 1 edition

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High-density microvia substrates: markets, applications, and infrastructure

by Jan Vardaman First published in 1999 — 1 edition

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Flip chip markets and infrastructure developments

by Jan Vardaman First published in 2001 — 1 edition

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Flexible circuits for high density applications

by Jan Vardaman First published in 2000 — 1 edition

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The lead-free movement: environmentally friendly electronics manufacturing

by Jan Vardaman First published in 2000 — 1 edition

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OLID: OL2857957A

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Created April 29, 2008
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